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International Unichip Corp. (GUC), the Superior ASIC Chief, introduced immediately that the GLink-3D interface (GUC’s Hyperlink for 3D die stacking) for the TSMC 3DFabric SoIC-X 3D stacking platform handed complete silicon testing, validating 3DIC interface hardening circulation. The primary GUC 3D buyer venture additionally handed full silicon testing, validating a full spectrum of 3D implementation providers for AI/HPC/Networking functions.
Typical AI/HPC/Networking chips mix massive reminiscence with high-performance logic. Logic features energy, velocity and dimension enchancment when scaled to essentially the most superior course of whereas the SRAM scaling features are reasonable. Stacking a logic chiplet at a extra superior course of node over an SRAM-dominant chiplet at an SRAM-scaling-efficient, much less superior node is essentially the most optimum value/efficiency answer. The high-bandwidth, low-latency, low-power GLink-3D interface IP is an enabler for this answer. Different challenges are thermal dissipation and energy distribution of 3D stacked chiplets. GUC developed a full 3D design circulation and carried out the primary buyer’s logic-over-memory 3D stacking product and it handed silicon validation. A silicon-correlated design and simulation circulation permit seamless implementation utilizing the rising UCIe-3D interface commonplace.
For the best 3D interface bandwidth density necessities, GUC developed the GLink-3D interface utilizing Double Knowledge Fee (DDR) and adaptive timing structure. The modular answer is versatile sufficient to help customers’ buses and clocking schemes and to keep away from cross-die/nook timing closure challenges whereas offering 9 Tbps/mm2 bandwidth density. GLink-3D was validated utilizing TSMC’s first SoIC-X take a look at chip with N5 CPU logic over N6 SRAM stacked dies. IP robustness was validated throughout a full vary of process-voltage-temperature corners, proving BER <1E-30, excessive provide voltage and frequency margins, and powerful provide noise immunity. The subsequent era GLink-3D for N2 to N7, concentrating on 20-40Tbps/mm2, 0.2ns-0.6ns latency and UCIe-3D compliant, can also be beneath improvement.
By International Unichip Corp. 04.18.2024
By Shruti Usgaonkar, Principal Engineer, Microchip Expertise 04.18.2024
“3D packaging strikes chiplet interface from die edge to essentially the most optimum location anyplace in a chiplet, making the shortest interconnect between logic and reminiscence,” mentioned Aditya Raina, CMO of GUC. “Along with CoWoS®, InFO, and SoIC design experience, bundle design, electrical and thermal simulations, and DFT and manufacturing testing, we offer our prospects with a sturdy and complete answer, enabling quick design cycles and fast time-to-market of their AI/HPC/xPU/Networking merchandise.”
“3D know-how allows techniques combining big processing energy and huge reminiscence, with every part created in essentially the most environment friendly course of node,” mentioned Igor Elkanovich, CTO of GUC. “We developed and silicon-validated 3D interface (GLink-3D) hardening service, 3D bodily implementation and timing closure, sign integrity, energy distribution and integrity, and SoIC thermal and mechanical simulations – a full bundle of providers permitting low-risk adoption of 3D know-how in our prospects’ initiatives.”
Study Extra about GUC’s GLink IP with InFO/CoWoS Whole Resolution
For extra data, please contact your GUC gross sales consultant instantly or e mail guc_sales@guc-asic.com.
CoWoS® is a registered trademark of Taiwan Semiconductor Manufacturing Co. in the US, Europe, China, Taiwan and/or different nations.
About GUC
International Unichip Corp. (GUC) is the Superior ASIC Chief that gives the semiconductor trade with main IC implementation and SoC manufacturing providers, utilizing superior course of and packaging know-how. Based mostly in Hsinchu, Taiwan, GUC has developed a world status with a presence in China, Europe, Japan, Korea, North America and Vietnam. GUC is publicly traded on the Taiwan Inventory Alternate beneath the image 3443. For extra data, go to www.guc-asic.com.
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